Semiconductor device with sealed semiconductor chip

ABSTRACT

A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame including first and second internal leads arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and first and second bonding wires by which the first internal leads and the some of the bonding pads are bonded to each other. The semiconductor device further includes a hanging pin section provided on the element non-forming surface of the semiconductor chip, and a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromprior Japanese Patent Applications No. 2005-138718, filed May 11, 2005;No. 2005-291391, filed Oct. 4, 2005; and No. 2006-115959, filed Apr. 19,2006, the entire contents of all of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device. Morespecifically, the invention relates to a semiconductor device having apackage structure in which a semiconductor chip with a plurality of padsalong one side thereof is mounted on a lead frame and sealed with resinor the like (referred to as a packaged semiconductor devicehereinafter).

2. Description of the Related Art

A packaged semiconductor device having a ball grid array (BGA) structurein which a plurality of pads are all arranged along one side of asemiconductor chip, has recently been developed (Jpn. Pat. Appln. KOKAIPublication No. 2001-102515, pages 4 and 5 and FIG. 1, for example). Inthe packaged semiconductor device, the semiconductor chip is stacked onand displaced from a low-level chip, thereby reducing the size of thesemiconductor chip and facilitating wire bonding.

If, however, a semiconductor chip with a plurality of pads along oneside thereof is applied to a packaged semiconductor device having a thinsmall outline package (TSOP) structure, the following problem occurs. Inthis packaged semiconductor device, the semiconductor chip is fixed on adie pad section of a lead frame by an insulative adhesive, and the padson the chip are connected to the internal leads of the lead frame bybonding wires, respectively. Some of the internal leads are arrangedclose to the pads, whereas the others are arranged away from the pads.In order to connect the latter internal leads to the pads, very longbonding wires are required. In the subsequent resin-sealing process, thelong bonding wires are easily dropped due to resin, and adjacent bondingwires are easily brought into contact with each other (electricallyshort-circuited).

Jpn. Pat. Appln. KOKAI Publication No. 2001-217383 discloses asemiconductor device in which a semiconductor chip with a plurality ofbonding pads along one side of the main surface thereof and anothersemiconductor chip of the same type are stacked on the substrate andthus the bonding pads of these chips are close to each other.

BRIEF SUMMARY OF THE INVENTION

According to a first aspect of the present invention, there is provideda semiconductor device comprising a semiconductor chip with bondingpads, the bonding pads being arranged along one side of an elementforming surface of the semiconductor chip; a lead frame including firstinternal leads and second internal leads, the first internal leads beingarranged such that tips thereof correspond to some of the bonding padsof the semiconductor chip, and the second internal leads being arrangedsuch that tips thereof pass a element non-forming surface of thesemiconductor chip and correspond to some of other bonding pads of thesemiconductor chip; first bonding wires by which the first internalleads and the some of the bonding pads are connected to each other;second bonding wires by which the second internal leads and the some ofother bonding pads are connected to each other; a hanging pin sectionprovided on the element non-forming surface of the semiconductor chip;and a sealing member with which the semiconductor chip is sealedincluding the hanging pin section and a bonding section between thefirst and second internal leads and the first and second bonding wires.

According to a second aspect of the present invention, there is provideda semiconductor device comprising a semiconductor chip with bondingpads, the bonding pads being arranged along one side of an elementforming surface of the semiconductor chip; a lead frame includinginternal leads, the internal leads being arranged on the element formingsurface of the semiconductor chip and close to the bonding pads thereofsuch that tips of the internal leads correspond to the bonding pads ofthe semiconductor chip; bonding wires by which the tips of the internalleads and the bonding pads of the semiconductor chip are bonded; ahanging pin section provided on the element forming surface of thesemiconductor chip; and a sealing member with which the semiconductorchip is sealed including the hanging pin section and a bonding sectionbetween the internal leads and the bonding wires, the sealing memberbeing rectangular.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a sectional view showing a configuration of a packagedsemiconductor device having a TSOP structure according to a firstembodiment of the present invention;

FIG. 2 is a bottom view of the packaged semiconductor device shown inFIG. 1 to view the inside thereof from the bottom thereof;

FIG. 3 is a top view of the packaged semiconductor device shown in FIG.1 to view the inside thereof from the top thereof;

FIG. 4A is a plan (top) view showing a configuration of a semiconductorchip that is applied to the packaged semiconductor device shown in FIG.1;

FIG. 4B is a side view of the semiconductor chip shown in FIG. 4A;

FIG. 5 is a plan view of external terminals assigned to bonding pads ofthe semiconductor chip shown in FIGS. 4A and 4B;

FIG. 6 is a plan view showing a configuration of a lead frame that isapplied to the packaged semiconductor device shown in FIG. 1;

FIG. 7 is a plan view showing another configuration of the lead framethat is applied to the packaged semiconductor device shown in FIG. 1;

FIG. 8 is a plan view of the layout of a semiconductor chip, taking aNAND flash memory with bonding pads on one side as an example;

FIG. 9 is a top view of a packaged semiconductor device having a TSOPstructure according to a second embodiment of the present invention toview the inside thereof from the top thereof;

FIG. 10 is a sectional view showing a configuration of a packagedsemiconductor device having a TSOP structure according to a thirdembodiment of the present invention;

FIG. 11 is a bottom view of a packaged semiconductor device having aTSOP structure according to a fourth embodiment of the present inventionto view the inside thereof from the bottom thereof;

FIGS. 12A and 12B are sectional views each showing a configuration ofthe packaged semiconductor device shown in FIG. 11;

FIG. 13 is a plan (top) view showing a configuration of a semiconductorchip that is applied to the packaged semiconductor device shown in FIG.11;

FIG. 14 is a top view of a packaged semiconductor device having a TSOPstructure according to a fifth embodiment of the present invention toview the inside thereof from the top thereof;

FIGS. 15A and 15B are sectional views each showing a configuration of apackaged semiconductor device having a TSOP structure according to asixth embodiment of the present invention;

FIG. 16 is a bottom view showing a configuration of a packagedsemiconductor device having a TSOP structure according to a seventhembodiment of the present invention;

FIG. 17 is a sectional view of the configuration of the packagedsemiconductor device shown in FIG. 16;

FIGS. 18A and 18B are comparative diagrams showing a comparison betweena section of the packaged semiconductor device shown in FIG. 16 and thatof another packaged semiconductor device; and

FIG. 19 is a sectional view showing a configuration of a packagedsemiconductor device having a TSOP structure according to an eighthembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will be described with reference tothe accompanying drawings. It should be noted that the drawings areschematic ones and the dimension ratios shown therein are different fromthe actual ones. The dimensions vary from drawing to drawing and so dothe ratios of dimensions.

First Embodiment

FIGS. 1 to 3 show a basic configuration of a semiconductor device(packaged semiconductor device) having a TSOP structure according to afirst embodiment of the present invention. Of these figures, FIG. 1 is asectional view of the packaged semiconductor device, FIG. 2 is a bottomview of the packaged semiconductor device to view the inside thereoffrom the back surface, and FIG. 3 is a top view of the packagedsemiconductor device to view the inside thereof from the top surface.

Referring to FIGS. 1 to 3, a lead frame 11 includes external leads 11 cand 11 d, internal leads 11 a and 11 b, and a hanging pin section 11 f.The internal leads 11 a and 11 b correspond to internally extendedportions of the external leads 11 c and 11 d. The internal leads 11 aand 11 b differ from each other in length. For example, some (middleones) of the internal leads 11 b, which are longer than the internalleads 11 a, are used as a die lead section (chip mounting section) onwhich a semiconductor chip 10 is mounted. The internal leads 11 a and 11b are not depressed from each other, but almost flush with each other.

The hanging pin section 11 f is connected to each of the outermost onesof the longer internal leads 11 b.

As shown in FIGS. 4A and 4B, bonding pads 13 are arranged on the elementforming surface of the semiconductor chip 10 and along one side of thechip 10. A thin sheet-shaped organic insulation film 12 having athickness of about 20 μm to 40 μm is adhered to the back surface(element non-forming surface) of the chip 10. The organic insulationfilm 12 is made of, e.g., polyimide epoxy resin.

The semiconductor chip 10 is mounted on the die lead section of thelonger internal leads 11 b and the hanging pin section 11 f by theorganic insulation film 12 and a normal mounting agent. The bonding pads13 are close to the shorter internal leads 11 a on which thesemiconductor chip 10 is not mounted. In other words, the tips of theshorter internal leads 11 a are opposed to the bonding pads 13, and thelonger internal leads 11 b pass the back surface of the chip 10 andextend such that their tips are located between the chip 10 and theshorter internal leads 11 a.

The organic insulation film 12 is used to enhance the insulativenessbetween the back surface of the chip 10 and the die lead section. Afilm-shaped insulative adhesive, which is attached to the back of awafer, can be used as the organic insulation film 12 in a scribe(dicing) step of separating the chip 10 from the wafer. There is a casewhere the organic insulation film 12 is not used when a plurality ofsemiconductor chips are stacked one on another.

As shown in FIGS. 1 and 2, the shorter internal leads 11 a on which thechip 10 is not mounted, or the internal leads 11 a located away from thebonding pads 13 are connected to some of the bonding pads 13 by firstbonding wires 141. On the other hand, the tips of the longer internalleads 11 b on which the chip 10 is mounted are connected to some of theother bonding pads 13 by second bonding wires 142.

The internal leads 11 a and 11 b, hanging pin section 11 f, chip 10 andbonding wires 141 and 142 of the lead frame 11 are sealed with resin(sealing member) 15 to form a resin package. The resin package is soconfigured that the sealed portion of the lead frame 11 on thechip-mounting surface (the back of the packaged semiconductor device) isthicker than that on the chip non-mounting surface (the surface of thepackaged semiconductor device). Thus, the chip 10 is sealed in almostthe middle part of the resin package in its thickness direction.

The portions communicating with the internal leads 11 a and 11 bprotrude from at least opposing sides of the resin package to form theexternal leads 11 c and 11 d (parts of the lead frame 11). In otherwords, the external leads 11 c and 11 d protrude from a position that ishigher than the middle of the resin package in its thickness direction.The external leads 11 c and 11 d extend along the sides of thesemiconductor chip 10 and bend toward the chip mounting surface of thelead frame 11. The tips of the external leads 11 c and 11 d bend awayfrom the resin package and serve as external terminals. In other words,the chip 10 is sealed facedown in the resin package.

The packaged semiconductor device shown in FIGS. 1 to 3 has achip-on-lead (COL) structure in which the chip 10 is adhesively fixed tothe longer internal leads 11 b and the internal leads 11 a and 11 b areconnected to the bonding pads 13 by the bonding wires 141 and 142. Theinternal leads 11 a and 11 b are arranged on almost the same plane andnot depressed. Since none of them are depressed, a mounting step and abonding step can easily be executed. If the lead frame is depressed,variations in depression affect the mounting and bonding steps. If alead frame has to be depressed, a depressing step is required inmanufacturing the lead frame. The depressing step makes themanufacturing complicated and exerts an adverse influence on framemanufacturing yields.

The hanging pin section 11 f of the lead frame 11 is fixed to theelement non-forming surface of the chip 10. When the lead frame 11 issealed with resin 15, the moldability of the sealed frame 11 can bestabilized. The appearance of the semiconductor device can thus beenhanced more than a device in which the chip 10 is fixed by theinternal leads 11 b only.

The chip 10 is fixed on the die lead section corresponding to almost themiddle portions of the longer internal leads 11 b. The bonding pads 13of the chip 10 are connected to the tips of the internal leads 11 a and11 b which are close to the bonding pads 13 and, in other words, wirebonding is performed on one side of the chip 10 along which the bondingpads 13 are arranged. The bonding wires 141 and 142 need not be long;consequently, it is not likely that the bonding wires will be dropped oradjacent bonding wires will be electrically short-circuited when thelead frame is sealed with resin after the wire-bonding step.Accordingly, the semiconductor device is improved in reliability.

The resin package is so configured that the sealed portion of the chipmounting section of the lead frame 11 is thicker than that of the chipnon-mounting section thereof. The chip 10 can thus be sealed close toalmost the middle of the resin package in its thickness direction.

The external leads 11 c and 11 d protrude from the sides of the resinpackage, extend along the sides of the semiconductor chip 10 and bendtoward the chip mounting section of the lead frame 11. The chip 10 issealed facedown in the resin package. In a device assembly step, whenthe top surface of the formed resin package, or the resin packagesurface on the chip non-mounting surface of the lead frame 11 isirradiated with laser beams for marking, the internal leads 11 b areinterposed between the irradiated surface and the chip 10. The adverseeffects of causing damage to the chip 10 by laser beams transmittedthrough the resin 15 or causing a disconnection by laser beamstransmitted through the bonding wires 141 and 142 can thus be lessened.

Since the bonding pads 13 are arranged locally along one side of theelement forming surface of the semiconductor chip 10, the chip 10 can bedecreased in size. A large-capacity memory chip such as a NAND flashmemory varies in area because the wire connection of peripheral circuitsis made efficient depending on how the peripheral circuits are laid out.When bonding pads are arranged locally along one side of the memory chipas in the chip 10 of the first embodiment, the wires are efficientlyconnected between the pads and the peripheral circuits and accordinglythe memory chip is decreased in size. Thus, the first embodiment isfavorably applied to, for example, a NAND flash memory as alarge-capacity memory chip, which requires a low-cost multilayerpackaging technique. An example of layout of a NAND flash memory withpads along one side thereof will be described later.

Since the internal leads 11 a and 11 b of the lead frame 11 are suppliedwith external signals or power supply or ground potentials, they have tobe insulated from the semiconductor chip 10. An insulation-type pastymounting agent or film-like mounting agent and the organic insulationfilm 12 of the back surface of the chip 10 can increase the electricalinsulativeness between the chip 10 and the internal leads 11 b with highreliability.

Since the chip 10 is adhered onto the die lead section by the thinorganic insulation film 12, it is suitable for the TSOP structure. Thedifference in level between the top surface (element forming surface) ofthe chip 10 and the tips of the internal leads 11 a and 11 b can thus belessened to facilitate wire bonding. Since, moreover, the bonding wires141 and 142 are arranged locally in the direction of one side of thechip 10 mounted on the internal leads 11 b, a larger chip can bemounted.

FIG. 5 shows an example of external terminals assigned to the bondingpads 13 arranged on the element forming surface of the semiconductorchip 10. In this example, a memory integrated circuit device such as aNAND flash memory is employed as the packaged semiconductor device. Inthe example of FIG. 5, the bonding pads 13 of the semiconductor chip 10are laterally opposed to those of the chip shown in FIG. 4.

In the first embodiment, the number of bonding pads 13 is eighteen. Forexample, external terminals VCC, VSS, I/O (I/O-0 to I/O-7), RB, RE, CE,CLE, ALE, WE and WP are assigned to the bonding pads. In particular, VSSis assigned to two bonding pads.

The bonding pad to which VCC is assigned is a VCC input pad for applyinga power supply potential (VCC). The bonding pads to which VSS areassigned are VSS input pads for applying a ground potential (VSS). Thebonding pads to which I/O-0 to I/O-7 are assigned are input pads forinputting/outputting an address, a command and input/output data. Thebonding pad to which RB is assigned is an output pad for notifying anexternal device of the internal operating status of the device. Thebonding pad to which RE is assigned is an output pad for outputting dataserially. The bonding pad to which CE is assigned is an input pad forreceiving a device selecting signal. The bonding pad to which CLE isassigned is a pad for receiving a signal to control the transmission ofan operating command to a command register (not shown) in the device.The bonding pad to which ALE is applied is a pad for receiving a signalto control the transmission of address data and input data to an addressregister and a data register (neither of which is shown) in the device.The bonding pad to which WE is applied is a pad for receiving a signalto control the transmission of data into the device from an I/Oterminal. The bonding pad to which WP is applied is a pad for receivinga signal to forcibly inhibit data from being written and erased.

(Example 1 of Lead Frame)

FIG. 6 specifically shows an example of a lead frame that is applied tothe packaged semiconductor device according to the first embodiment ofthe present invention. In this example, a memory integrated circuitdevice such as a NAND flash memory is employed as the packagedsemiconductor device. FIG. 6 shows a lead frame 11A whose internal leadsare laterally opposed to the internal leads 11 a and 11 b of the leadframe 11 in the first embodiment. In FIG. 6, VCC, VSS, I/O-0 to I/O-7,RB, RE, CE, CLE, ALE, WE and WP are external terminals, and N.C is anunused (noncontact) internal lead.

Referring to FIG. 6, the tips of longer internal leads 11 b are locatedlocally close to the middle of the lead frame 11A in its widthdirection, and the tips of shorter internal leads 11 a are located onboth sides of a group of the longer internal leads 11 b. Since theshorter internal leads 11 a are difficult to bend sharply in terms ofthe manufacture of the lead frame 11A, it is favorable that they shouldbe formed outside the longer internal leads 11 b as described above.Since the longer internal leads 11 b can be extended with a high degreeof freedom, they are located close to the middle of the lead frame 11A.

The shorter internal leads 11 a correspond to the external terminalsI/O-0 to I/O-7 for 8-bit data input/output and are connected to theirnearby pads by wire bonding.

In the lead frame 11A, the outermost leads, which are broader than theinternal leads 11 a and 11 b, are connected to the hanging pin sections11 f and supported by the outside main body of the frame.

(Example 2 of Lead Frame)

FIG. 7 specifically shows an example of a lead frame that is applied tothe packaged semiconductor device according to the first embodiment ofthe present invention. In this example, a memory integrated circuitdevice such as a NAND flash memory is employed as the packagedsemiconductor device. FIG. 7 shows a lead frame 11B whose internal leadsare laterally opposed to the internal leads 11 a and 11 b of the leadframe 11 in the first embodiment. In FIG. 7, VCC, VSS, I/O-0 to I/O-7,RB, RE, CE, CLE, ALE, WE and WP are external terminals, and N.C is anunused (noncontact) internal lead.

Referring to FIG. 7, in each of two sections into which the lead frame11B is divided in its width direction, the tips of longer internal leads11 b are located locally close to the middle of the section, and thetips of shorter internal leads 11 a are located on both sides of a groupof the longer internal leads 11 b.

The shorter internal leads 11 a corresponding to the external terminalsI/O-0 to I/O-7 for 8-bit data input/output are remote from the bondingpads 13 and connected to their nearby pads by wire bonding.

In the lead frame 11B, the outermost leads, which are broader than theinternal leads 11 a and 11 b, are connected to the hanging pin sections11 f and supported by the outside main body of the frame.

In the lead frame 11 of the first embodiment, preferably, the outermostleads are thickened and connected to the hanging pin sections 11 f onthe sides of the frame, or the hanging pin sections 11 f are connectedto each other in the package, and the support area of the chip 10 isincreased when the chip 10 is to be mounted, as shown in FIGS. 6 and 7.Thus, the tips of the internal leads 11 b are inhibited from beingwarped and the internal leads 11 b can be prevented from being deformeddue to the weight of the chip 10, as compared with the structure inwhich the chip 10 is supported by only the internal leads 11 b arrangedalong one side thereof. Consequently, when the lead frame 11 is sealedwith resin 15, the moldability of the sealed frame 11 can be improved,and the appearance of the device can be enhanced more than a device inwhich the chip 10 is fixed by the internal leads 11 b only.

FIG. 8 shows a specific layout of a semiconductor chip that is appliedto the packaged semiconductor device according to the first embodimentof the present invention. In this semiconductor chip, a NAND flashmemory with pads along one side thereof is integrated monolithically.

The semiconductor chip 10 shown in FIG. 8 has a layout for a cell array10 a, a bit line selection circuit 10 b, a sense amplifier and latchcircuit 10 c, a column decoder 10 d, a driver 10 e, a row decoder 10 f,and a peripheral circuit 10 g.

The cell array 10 a includes a plurality of memory cells arranged inmatrix. The cell array 10 a also includes a plurality of word lines andselection gate lines that run in the row direction of the matrix, aplurality of bit lines that run in the column direction thereof, and ashield power supply (not shown) that supplies potential to shieldodd-numbered bit lines and even-numbered bit lines.

The bit line selection circuit 10 b is arranged adjacent to the cellarray 10 a in the column direction. The sense amplifier and latchcircuit 10 c and the column decoder 10 d are arranged adjacent to oneside of the bit line selection circuit 10 b, which does not face thecell array 10 a. The row decoder 10 f is arranged adjacent to the cellarray 10 a in the row direction. The driver 10 e is arranged close tothe row decoder 10 f in the column direction and close to the bit lineselection circuit 10 b, sense amplifier and latch circuit 10 c andcolumn decoder 10 d in the row direction. The peripheral circuit 10 g isarranged close to the driver 10 e and the column decoder 10 d in thecolumn direction.

As described above, the driver 10 e, which drives the bit line selectioncircuit 10 b, is integrated. The degree of integration is thus improvedand the device can be decreased in size.

The sense amplifier and latch circuit 10 c amplifies and latches thedata read out of a memory cell via a bit line.

When an odd-numbered bit line conducts to the sense amplifier and latchcircuit 10 c, the bit line selection circuit 10 b conducts aneven-numbered bit line to the shield power supply. When an even-numberedbit line conducts to the sense amplifier and latch circuit 10 c, the bitline selection circuit 10 b conducts an odd-numbered bit line to theshield power supply. The bit line selection circuit 10 b has both afunction of selecting a bit line and connecting it to the senseamplifier and latch circuit 10 c and a function of connecting anon-selected bit line to the shield power supply. As compared with thecase of two different circuits having these functions, the degree ofintegration can be improved and the device can be decreased in size.

A read operation of the NAND flash memory will be described in brief.The row decoder 10 f selects one of blocks (not shown) of the cell array10 a and one of word lines (not shown). The driver 10 e applies apotential Vsg (e.g., 3.5V) to a select gate in the selected block viathe row decoder 10 f and applies a ground potential GND to a select gatein the non-selected block. In read mode, the driver 10 e applies aground potential GND to the selected word line via the row decoder 10 fand applies a voltage Vs (e.g., 3.5V) to the non-selected word line.

The column decoder 10 d selects one of bit lines (not shown) in responseto a column address signal from an address buffer of the peripheralcircuit 10 g. The sense amplifier and latch circuit 10 c amplifies andlatches the data that is received from the selected bit line via the bitline selection circuit 10 b. The data is supplied from the senseamplifier and latch circuit 10 c to an I/O buffer of the peripheralcircuit 10 g via the column decoder 10 d.

Second Embodiment

FIG. 9 shows a basic configuration of a semiconductor device (packagedsemiconductor device) having a TSOP structure according to a secondembodiment of the present invention. FIG. 9 is a plan (top) view of thepackaged semiconductor device to view the inside thereof from the topsurface thereof. The same components as those of the packagedsemiconductor device of the first embodiment are denoted by the samereference numerals and their detailed descriptions are omitted.

The second embodiment differs from the first embodiment in that ahanging pin section 11 f is not connected to the outermost one of longerinternal leads 11 b, but adhered to the back surface of a semiconductorchip 10.

In the second embodiment, too, when a lead frame is sealed with resin15, the moldability of the sealed frame can be stabilized and thus theappearance of the semiconductor device can be enhanced more than adevice in which the chip 10 is fixed by the internal leads 11 b only.

When the packaged semiconductor device according to the secondembodiment is applied to, for example, a NAND flash memory, the leadframes 11A and 11B shown in FIGS. 6 and 7 can be adopted, except thatthe hanging pin sections are connected to the internal leads.

Third Embodiment

FIG. 10 is a sectional view showing a configuration of a semiconductordevice (packaged semiconductor device) having a TSOP structure accordingto a third embodiment of the present invention. The packagedsemiconductor device of the third embodiment differs from that of thefirst embodiment in the following respect. As shown in FIG. 10, thedevice includes two semiconductor chips 10 and 102 each having padsalong one side thereof. The pads of the chips 10 and 102 are of the sametype and/or the same size and close to each other. The chips 10 and 102are horizontally displaced from each other and stacked one on anotherwith an insulative adhesive 122 between them. Since the other componentsare the same as those of the first embodiment, they are denoted by thesame reference numerals as those in FIG. 1.

In the semiconductor device shown in FIG. 10, the first chip 10 havingfirst bonding pads (not shown but corresponding to the bonding pads 13shown in FIG. 4A) is mounted on a hanging pin section (not shown) and adie lead section of longer internal leads 11 b of a lead frame 11 with athin organic insulation film 12 and a normal mounting agenttherebetween. The second chip 102 has the same configuration as that ofthe first chip 10 and includes second bonding pads (not shown) along oneside thereof. The second bonding pads of the second chip 102 are closeto the first bonding pads of the first chip 10. The second chip 102 isstacked on but displaced from the first chip 10 with the insulativeadhesive 122 therebetween.

The bonding wires of the third embodiment are divided into four bondingwire groups 141 to 144. The first bonding wire group 141 is used toconnect the tips of some of the internal leads 11 a on which the firstchip 10 is not mounted to some of the first bonding pads on the firstchip 10.

The second bonding wire group 142 is used to connect the tips of some ofthe internal leads 11 a on which the first chip 10 is mounted to some ofthe first bonding pads on the first chip 10.

The third bonding wire group 143 is used to connect the tips of some ofthe internal leads 11 a on which the first chip 10 is not mounted tosome of the second bonding pads on the second chip 102.

The fourth bonding wire group 144 is used to connect the tips of some ofthe internal leads 11 a on which the first chip 10 is mounted to some ofthe second bonding pads on the second chip 102.

The resin 15 is used to seal the internal leads 11 a and 11 b, hangingpin section, first and second chips 10 and 102 and bonding wire groups141 to 144 to thereby form a resin package.

External leads 11 c and 11 d (each of which is part of the lead frame11) communicate with their respective internal leads 11 a and 11 b andprotrude as external terminals from at least opposed sides of the resinpackage.

The packaged semiconductor device shown in FIG. 10 has a COL structureand brings the same advantages as those of the first embodiment. Morespecifically, the first chip 10 is adhesively fixed to almost the middleportions of the longer internal leads 11 b in their length direction,and the second chip 102 is adhesively fixed onto the first chip 10 andhorizontally displaced therefrom. The bonding pads on the first andsecond chips 10 and 102 are connected to the tips of their nearbyinternal leads 11 a and 11 b by bonding pads. No long bonding wires aretherefore required. Consequently, it is not likely that the bondingwires will be dropped or adjacent bonding wires will be electricallyshort-circuited when the lead frame is sealed with resin after thewire-bonding step. Accordingly, the semiconductor device is improved inreliability.

In particular, the hanging pin section of the lead frame 11 is fixed tothe non-element-forming surface of the chip 10. When the lead frame 11is sealed with resin 15, the moldability of the sealed frame 11 can beimproved, and the appearance of the device can be enhanced more than adevice in which the chip 10 is fixed by the internal leads 11 b only.

Since the first chip 10 is fixed onto the internal leads 11 b by theorganic insulation film 12, it is suitable for the TSOP structure, andthe difference in level between the top surface of the chip and theinternal leads 11 a and 11 b can be lessened to facilitate wire bonding.Since, moreover, the chips are stacked one on another, they can bemounted at high densities.

The present invention is not limited to the above first to thirdembodiments. For example, a lead frame having a lead fixing tape with aninsulative adhesive can be adopted in order to prevent the longerinternal leads 11 b from being relatively shifted from each other orprevent the tips of the internal leads from contacting each other.

Fourth Embodiment

FIGS. 11 and 12A and 12B show a basic configuration of a semiconductordevice (packaged semiconductor device) having a TSOP structure accordingto a fourth embodiment of the present invention. A memory integratedcircuit device such as a NAND flash memory is employed as the packagedsemiconductor device. Of these figures, FIG. 11 is a plan (top) view ofthe packaged semiconductor device to view the inside thereof from thetop thereof, FIG. 12A is a sectional view of the tips of internal leadsextending from external leads of the packaged semiconductor device, andFIG. 12B is a sectional view of a hanging pin section that isperpendicular to the longitudinal direction of the external leads.

Referring to FIGS. 11 and 12A and 12B, a lead frame 211 includes aplurality of hanging pin sections 211 f, a plurality of external leads211 c which are drawn from the shorter sides of resin 215 of a package,and a plurality of internal leads 211 which are extended into thepackage from the external leads 211 c and some of which are bent towardone of the longer sides of resin 215. The internal leads 211 a arelonger in the middle of the resin 215 in its longitudinal direction andbecome shorter with distance from the middle. The internal leadsconnected to the external leads that are far from one of the longersides of resin 215 are longer, while the internal leads connected to theexternal leads that are close to the one of the longer sides of resin215 are shorter.

The internal leads 211 a excluding their tips are used as a die leadsection (chip mounting section) on which a semiconductor chip 210 ismounted as a memory chip. The internal leads 211 a are not depressed butalmost flush with each other. Since the lead frame 211 is not depressed,there is no fear that a variation in amount of depression will affect adevice manufacturing process, complicate a frame manufacturing step, oradversely affect frame manufacturing yields.

In the fourth embodiment, the hanging pin sections 211 f are notconnected any of the internal leads 211 a or the semiconductor chip(memory chip) 210.

The semiconductor chip 210 has bonding pads along one longer side of theelement forming surface thereof, as shown in FIG. 13. A thinsheet-shaped organic insulation film 212 having a thickness of about 20μm to 40 μm is adhered to the back surface (element non-forming surface)of the chip 210. The organic insulation film 212 is made of, e.g.,polyimide epoxy resin. In the fourth embodiment, too, the bonding padsare arranged locally along one of the longer sides of the chip 210;therefore, the chip 210 can be decreased in size.

As shown in FIGS. 12A and 12B, the chip 210 is mounted on the die leadsection of the internal leads 211 a with the organic insulation film 212and a normal mounting agent therebetween. The chip 210 is so providedthat their bonding pads are arranged close to the tips of the internalleads 211 a. In other words, the longer sides of the chip 210 correspondto the longer sides of the resin 215, and the bonding pads are arrangedto face the tips of the internal leads 211 a.

The organic insulation film 212 is used to enhance the insulativenessbetween the back surface of the chip 210 and the die lead section. Afilm-shaped insulative adhesive, which is attached to the back of awafer, can be used as the organic insulation film 212 in a scribe(dicing) step of separating the chip 210 from the wafer. There is a casewhere the organic insulation film 212 is not used when a plurality ofsemiconductor chips are stacked one on another.

The bonding pads of the semiconductor chip 210 are connected to theinternal leads 211 a of the lead frame 211 by bonding wires 240,respectively.

The internal leads 211 a, hanging pin sections 211 f, chip 210 andbonding wires 240 of the lead frame 211 are sealed with the resin 215 toform a rectangular resin package having a COL structure. The resinpackage is so configured that the sealed portion of the lead frame 211on the chip-mounting surface (the back of the packaged semiconductordevice) is thicker than that on the chip non-mounting surface (thesurface of the packaged semiconductor device). Thus, the chip 210 issealed facedown in almost the middle part of the resin package in itsthickness direction.

The portions communicating with the internal leads 211 a protrude fromone of shorter sides of the resin package to form the external leads 211c (parts of the lead frame 211). Furthermore, the external leads 211 cprotrude from a position that is higher than the middle of the resinpackage in its thickness direction. The external leads 211 c extendalong the sides of the semiconductor chip 210 and bend toward the chipmounting surface of the lead frame 211. The tips of the external leads211 c bend away from the resin package and serve as external terminals.

According to the packaged semiconductor device shown in FIGS. 11, 12Aand 12B, even though the longer side of the chip 210 along which thebonding pads are locally arranged cannot correspond to the shorter sideof the resin 215 from which the external leads are protruded, the longerside of the chip 210 can correspond to the longer side of the resin 215to thereby package the semiconductor device. A larger-sizedsemiconductor chip such as the chip 210 can thus be incorporated intothe resin package by simply changing the design of the lead frame 211.

The bonding pads of the chip 210 are brought nearer to the tips of theinternal leads 211 a, or wire bonding is performed on one side of thechip 210 along which the bonding pads are arranged. The bonding wires240 need not be long. Consequently, it is not likely that the bondingwires will be dropped or adjacent bonding wires will be electricallyshort-circuited when the lead frame is sealed with resin after thewire-bonding step. Accordingly, the semiconductor device is improved inreliability.

The chip 210 is sealed facedown in the resin package. Even though theresin package surface on the chip non-mounting surface of the lead frame211 is irradiated with laser beams for marking in a device assemblystep, the adverse effects of causing damage to the chip 210 by laserbeams transmitted through the resin 215 or causing a disconnection bylaser beams transmitted through the bonding wires 240 can be lessened.

The packaged semiconductor device according to the fourth embodiment isnot limited to a NAND flash memory. If, however, it is applied to a NANDflash memory, a lead frame 211′ as shown in FIG. 14 can be adopted.

Fifth Embodiment

FIG. 14 shows a basic configuration of a semiconductor device (packagedsemiconductor device) having a TSOP structure according to a fifthembodiment of the present invention. FIG. 14 is a plan (top) view of thepackaged semiconductor device to view the inside thereof from the topsurface thereof. The same components as those of the packagedsemiconductor device of the fourth embodiment are denoted by the samereference numerals and their detailed descriptions are omitted.

The fifth embodiment differs from the fourth embodiment in the followingrespect. Some of hanging pin sections 211 f are not connected tointernal leads 211 a but adhered to the back surface of a semiconductorchip 210, and/or some of hanging pin sections 211 f are used as some ofinternal leads 211 a and adhered to the back surface of thesemiconductor chip 210.

According to the fifth embodiment, when a lead frame 211′ is sealed withresin 215, the moldability of the sealed frame can be stabilizedfurther. Since the hanging pin sections 211 f of the lead frame 211′ arefixed to the element non-forming surface of the chip 210, the appearanceof the semiconductor device can be enhanced more than a device in whichthe chip 210 is fixed by the internal leads 211 a only.

Sixth Embodiment

FIGS. 15A and 15B show a basic configuration of a semiconductor device(packaged semiconductor device) having a TSOP structure according to asixth embodiment of the present invention. FIG. 15A is a sectional viewof the tips of internal leads extending from external leads of thepackaged semiconductor device, and FIG. 15B is a sectional view of ahanging pin section that is perpendicular to the longitudinal directionof the external leads.

The packaged semiconductor device of the sixth embodiment differs fromthat of the fourth embodiment in the following respect. As shown inFIGS. 15A and 15B, the device includes two semiconductor chips 210 a and210 b each having pads along one side thereof. The pads of the chips 210a and 210 b are of the same type and/or the same size and close to eachother. The chips 210 a and 210 b are horizontally displaced from eachother and stacked one on another with an insulative adhesive betweenthem. Since the other components are the same as those of the fourthembodiment, they are denoted by the same reference numerals as those inFIG. 11.

In the semiconductor device shown in FIGS. 15A and 15B, the first chip210 a having first bonding pads (not shown) is mounted on a die leadsection of internal leads 211 a of a lead frame 211 with a thin organicinsulation film 12 and a normal mounting agent therebetween. The secondchip 210 b has the same configuration as that of the first chip 210 aand includes second bonding pads along one side thereof. The secondbonding pads of the second chip 210 b are close to the first bondingpads of the first chip 210 a. The second chip 210 b is stacked on butdisplaced from the first chip 210 a with the insulative adhesivetherebetween.

The bonding wires of the sixth embodiment are divided into two bondingwire groups 241 and 242. The first bonding wire group 241 is used toconnect the tips of some of the internal leads 211 a to some of thefirst bonding pads on the first chip 210 a. The second bonding wiregroup 242 is used to connect the tips of some of the internal leads 211a to some of the second bonding pads on the first chip 210 b.

The internal leads 211 a, hanging pin sections 211 f, chips 210 a and210 b and bonding wire groups 241 and 242 of the lead frame 211 aresealed with resin 215 to form a rectangular resin package.

The external leads 211 c (parts of the lead frame 211) communicatingwith the internal leads 211 a protrude from the shorter sides of theresin package to form external terminals.

The packaged semiconductor device shown in FIGS. 15A and 15B has a COLstructure and brings almost the same advantage as that of the deviceaccording to the fourth embodiment. In other words, a large-sizedsemiconductor chip, such as chips 210 a and 210 b whose longer sides arelonger than the shorter sides of the resin package (or shorter than thelonger sides thereof), can be incorporate into the resin package.

In particular, since the first chip 210 a is fixed onto the internalleads 211 a by the thin organic insulation film, it is suitable for theTSOP structure and the difference in level between the top surface ofthe chip and the internal leads 211 a can be lessened to facilitate wirebonding.

Since the chips 210 a and 210 b are stacked one on another, they can bemounted at high densities. Therefore, the sixth embodiment is favorablyapplied to, for example, a NAND flash memory as a large-capacity memorychip, which requires a low-cost multilayer packaging technique.

The first chip 210 a is adhesively fixed on the internal leads 211 a,and the second chip 210 b is adhesively fixed onto but horizontallydisplaced from the first chip 210 a. The bonding pads of these chips 210a and 210 b are connected to their nearby tips of the internal leads 211a. Thus, the bonding wires 241 and 242 need not be long. Consequently,it is not likely that the bonding wires will be dropped or adjacentbonding wires will be electrically short-circuited when the lead frameis sealed with resin after the wire-bonding step; accordingly, thesemiconductor device is improved in reliability.

When the hanging pin sections 211 f of the lead frame 211′ are fixed onthe element non-forming surface of the chip 210 a (see FIG. 14), thelead frame 211′ is sealed with resin 215 and its moldability can bestabilized further. The appearance of the semiconductor device can beenhanced more than a device in which the chip 210 a is fixed by theinternal leads 211 a only.

The present invention is not limited to the above fourth to sixthembodiments. For example, a lead frame having a lead fixing tape with aninsulative adhesive can be adopted in order to prevent the internalleads 211 a from being relatively shifted from each other or prevent thetips of the internal leads from contacting each other.

Seventh Embodiment

FIGS. 16 and 17 show a configuration of a semiconductor device (packagedsemiconductor device) having a TSOP structure according to a seventhembodiment of the present invention. A memory integrated circuit devicesuch as a NAND flash memory is employed as the packaged semiconductordevice. Of these figures, FIG. 16 is a plan (bottom) view of thepackaged semiconductor device to view the inside thereof from the bottomthereof, and FIG. 17 is a sectional view of the tips of internal leadsextending from external leads of the packaged semiconductor device.

Referring to FIGS. 16 and 17, a lead frame 311 includes a plurality ofhanging pin sections 311 f, a plurality of external leads 311 c whichare drawn from the shorter sides of resin 315 of a package, and aplurality of internal leads 311 a which are extended into the packagefrom the external leads 311 c and some of which are bent toward one ofthe longer sides of the resin 315. The internal leads 311 a are longerin the middle of the resin 315 in its longitudinal direction and becomeshorter with distance from the middle. The internal leads connected tothe external leads that are far from one of the longer sides of theresin 315 are longer, while the internal leads connected to the externalleads that are close to the one of the longer sides of the resin 315 areshorter.

The internal leads 311 a including their tips are used as a die leadsection (chip mounting section) on which a semiconductor chip 310 ismounted as a memory chip. The internal leads 311 a are not depressed butalmost flush with each other. Since the lead frame 311 is not depressed,there is no fear that a variation in amount of depression will affect adevice manufacturing process, complicate a frame manufacturing step, oradversely affect frame manufacturing yields.

In the seventh embodiment, the hanging pin sections 311 f are notconnected to any of the internal leads 311 a, but some of the hangingpin sections 311 f are fixed onto the element forming surface of thesemiconductor chip 310.

The semiconductor chip 310 has bonding pads along one longer side of theelement forming surface thereof. A thin sheet-shaped organic insulationfilm 312 having a thickness of about 20 μm to 40 μm is adhered to thesame element forming surface of the chip 310. The organic insulationfilm 312 is made of, e.g., polyimide epoxy resin. In the seventhembodiment, too, the bonding pads are arranged locally along one of thelonger sides of the chip 310; therefore, the chip 310 can be decreasedin size.

As shown in FIG. 16, the chip 310 is mounted on the die lead sectionincluding the tips of the internal leads 311 a of the lead frame 311,with the organic insulation film 312 and a normal mounting agenttherebetween. The chip 310 is so provided that their bonding pads arearranged close to the tips of the internal leads 311 a. In other words,the longer sides of the chip 310 correspond to the longer sides of theresin 315, and the bonding pads are arranged close to the tips of theinternal leads 311 a. In particular, the bonding pads of thesemiconductor chip 310 correspond to extended portions of the tips ofthe internal leads 311 a.

The bonding pads of the semiconductor chip 310 are connected to theinternal leads 311 a of the lead frame 311 by bonding wires 340,respectively. In the seventh embodiment, the wire bonding, or thebonding between the bonding pads and the tips of the internal leads bythe bonding wires 340 is performed on the element forming surface of thesemiconductor chip 310.

The internal leads 311 a, hanging pin sections 311 f, chip 310 andbonding wires 340 of the lead frame 311 are sealed with the resin 315 toform a rectangular resin package having a lead on chip (LOC) structure.The resin package is so configured that the sealed portion of the leadframe 311 on the chip non-mounting surface (the back of the packagedsemiconductor device) is thicker than that on the chip mounting surface(the surface of the packaged semiconductor device). Thus, the chip 310is sealed facedown slightly above almost the middle part of the resinpackage in its thickness direction.

The portions communicating with the internal leads 311 a protrude fromone of shorter sides of the resin package to form the external leads 311c (parts of the lead frame 311). Furthermore, the external leads 311 cprotrude from a position that is slightly displaced downward from themiddle of the resin package in its thickness direction. The externalleads 311 c extend along the sides of the semiconductor chip 310 andbend toward the chip non-mounting surface of the lead frame 311. Thetips of the external leads 311 c bend away from the resin package andserve as external terminals.

According to the packaged semiconductor device shown in FIGS. 16 and 17,even though the longer side of the chip 310 along which the bonding padsare locally arranged cannot correspond to the shorter side of the resin315 from which the external leads are protruded, the longer side of thechip 310 can correspond to the longer side of the resin 315 to therebypackage the semiconductor device. A larger-sized semiconductor chip suchas the chip 310 can thus be incorporated into the resin package bysimply changing the design of the lead frame 311.

In particular, when the wire bonding for bonding the bonding pads andthe internal leads 311 a is performed on the surface (element formingsurface) of the semiconductor chip 310, a larger-sized semiconductorchip can be mounted on the packaged semiconductor device of the samesize. Conversely, a smaller-sized packaged semiconductor device can beachieved if the size of the chip 310 is unchanged.

Moreover, when the hanging pin sections 311 f of the lead frame 311 arefixed on the element forming surface of the chip 310, the moldability ofthe frame sealed with the resin 315 can be stabilized, and theappearance of the device can be improved more than a device in which thechip 310 is fixed by the internal leads 311 a only.

The bonding pads of the chip 310 are brought nearer to the tips of theinternal leads 311 a, or wire bonding is performed on one side of thechip 310 along which the bonding pads are arranged. The bonding wires340 need not be long. Consequently, it is not likely that the bondingwires will be dropped or adjacent bonding wires will be electricallyshort-circuited when the lead frame is sealed with resin after thewire-bonding step. Accordingly, the semiconductor device is improved inreliability.

The chip 310 is sealed facedown in the resin package. Even though theresin package surface on the chip mounting surface of the lead frame 311is irradiated with laser beams for marking in a device assembly step,the adverse effects of causing damage to the chip 310 by laser beamstransmitted through the resin 315 or causing a disconnection by laserbeams transmitted through the bonding wires 340 can be lessened.

FIGS. 18A and 18B are sectional views of an end portion of the packagedsemiconductor device, which is taken along the line perpendicular to theprojection direction of the external lead. FIG. 18A shows the packagedsemiconductor device shown in FIG. 16 as an example, and FIG. 18B showsthe packaged semiconductor device shown in FIG. 11 as an example.

If the length of a short side of the packaged semiconductor device shownin FIG. 18A is Xa, Xa is defined by xa+2×ha where xa is the length of ashort side of the chip 310 and ha is the width of resin. In contrast, ifthe length of a short side of the packaged semiconductor device shown inFIG. 18B is Xa, Xa is defined by xa+2×ha+k where xa is the length of ashort side of the chip 210, ha is the width of resin, and k is thelength of a lead projection. The width ha of resin corresponds to thethickness of resin 315 from one end of the resin package to the chip 310and the thickness of resin 215 from one end of the resin package to thetip of the lead 211 a.

In short, when Xa and ha are the same, the semiconductor chip 310 whichis larger than the semiconductor chip 210 by the length k of the leadprojection can be mounted. In contrast, xa in the chip 210 and xa in thechip 310 are the same, a packaged semiconductor device of smaller size(Xa) can be achieved.

None of the above embodiments are limited to a configuration in which asemiconductor chip is sealed facedown in a resin package. Theembodiments can be applied to a configuration in which a semiconductorchip is sealed face up in a resin package.

Eighth Embodiment

FIG. 19 shows a configuration of a semiconductor device (packagedsemiconductor device) having a TSOP structure according to an eighthembodiment of the present invention. FIG. 19 is a sectional view of thetips of internal leads extending from external leads of the packagedsemiconductor device. The top view of the packaged semiconductor deviceis almost equivalent to the bottom view of FIG. 16.

The eighth embodiment differs from the seventh embodiment in that asemiconductor chip mounted on a lead frame is sealed face up in a resinpackage. More specifically, the packaged semiconductor device shown inFIG. 19 differs from that of the seventh embodiment in the followingrespect. The external leads 311 c of a lead frame 311 extend along thesides of the semiconductor chip 310 and bend toward the chip mountingsurface of the lead frame 311. The tips of the external leads 311 c bendaway from the resin package and serve as external terminals. Since theother components are the same as those of the seventh embodiment, theyare denoted by the same reference numerals as those in FIG. 17.

The semiconductor chip 310 has bonding pads on its one side. Referringto FIG. 19, the chip 310 is mounted on a die lead section of internalleads 311 a of the lead frame 311, with a thin organic insulation film312 and a normal mount agent interposed therebetween.

Bonding wires 340 are formed on the surface (element forming surface) ofthe chip 310 to bond the tips of the internal leads 311 a and thebonding pads on the chip 310.

The internal leads 311 a, hanging pin sections (not shown), chip 310 andbonding wires 340 are sealed with resin 315 to form a rectangular resinpackage.

The external leads 311 c (parts of the lead frame 311) are connected tothe internal leads 311 a and protruded from a pair of short sides of theresin package. The external leads 311 c thus serve as externalterminals.

According to the semiconductor package device shown in FIG. 19, alarge-sized semiconductor chip whose long sides are longer than theshort sides of the resin package (shorter than the long sides of theresin package) can be mounted in the resin package, as in the foregoingseventh embodiment.

In particular, when the wire bonding for bonding the bonding pads andthe internal leads 311 a is performed on the surface (element formingsurface) of the semiconductor chip 310, a larger-sized semiconductorchip can be mounted on the packaged semiconductor device of the samesize. Conversely, a smaller-sized packaged semiconductor device can beachieved if the size of the chip 310 is unchanged.

Moreover, when the hanging pin sections of the lead frame 311 are fixedon the element forming surface of the chip 310, the moldability of theframe sealed with the resin 315 can be stabilized, and the appearance ofthe device can be improved more than a device in which the chip 310 isfixed by the internal leads 311 a only.

The bonding wires 340 need not be long; consequently, it is not likelythat the bonding wires will be dropped and adjacent bonding wires willbe electrically short-circuited when the lead frame is sealed with resinafter the wire-bonding step. Accordingly, the semiconductor device isimproved in reliability.

Since the chip 310 is fixed on the internal leads 311 a by the thinorganic insulation film 312, it is suitable for the TSOP structure. Adifference between the level of the top of the chip and that of theinternal leads 311 a can be lessened to facilitate a wire bondingprocess.

None of the above embodiments are limited to a product using a resinpackage, but they can be applied to, for example, a packaged plasticproduct.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications may be madewithout departing from the spirit or scope of the general inventiveconcept as defined by the appended claims and their equivalents.

1. A semiconductor device comprising: a semiconductor chip with bondingpads, the bonding pads being arranged along one side of an elementforming surface of the semiconductor chip; a lead frame including firstinternal leads and second internal leads, the first internal leads beingarranged such that tips thereof correspond to some of the bonding padsof the semiconductor chip, and the second internal leads being arrangedsuch that tips thereof pass a element non-forming surface of thesemiconductor chip and correspond to some of other bonding pads of thesemiconductor chip; first bonding wires by which the first internalleads and said some of the bonding pads are bonded to each other; secondbonding wires by which the second internal leads and said some of otherbonding pads are bonded to each other; a hanging pin section provided onthe element non-forming surface of the semiconductor chip; and a sealingmember with which the semiconductor chip is sealed including the hangingpin section and a bonding section between the first and second internalleads and the first and second bonding wires.
 2. The semiconductordevice according to claim 1, wherein the second internal leads have achip mounting section on which the element non-forming surface of thesemiconductor chip is fixed.
 3. The semiconductor device according toclaim 1, wherein the first internal leads have a chip mounting sectionon which the element non-forming surface of the semiconductor chip isfixed.
 4. The semiconductor device according to claim 1, wherein thetips of the second internal leads are located between the tips of thefirst internal leads and the semiconductor chip.
 5. The semiconductordevice according to claim 1, wherein the tips of the second internalleads are located to correspond to middle ones of the bonding pads, andthe tips of the first internal leads are located to correspond to outerones of the bonding pads.
 6. The semiconductor device according to claim1, wherein the tips of the first internal leads are located tocorrespond to middle and outer ones of the bonding pads, and the tips ofthe second internal leads are located to correspond to other bondingpads.
 7. The semiconductor device according to claim 1, wherein the leadframe further includes first external leads communicating with the firstinternal leads and second external leads communicating with the secondinternal leads, and the first external leads and the second externalleads protrude from at least opposing sides of the sealing member. 8.The semiconductor device according to claim 1, wherein the hanging pinsection is a support member to support the lead frame against a framebody.
 9. The semiconductor device according to claim 1, wherein thehanging pin section is fixed on the element non-forming surface of thesemiconductor chip.
 10. The semiconductor device according to claim 1,wherein the hanging pin section is also used as some of the secondinternal leads.
 11. The semiconductor device according to claim 1,wherein the hanging pin section is connected to the lead frame.
 12. Thesemiconductor device according to claim 1, wherein the hanging pinsection is connected to an outermost one of the second internal leads.13. The semiconductor device according to claim 1, wherein thesemiconductor chip is sealed facedown with the sealing member such thatthe element forming surface thereof faces down.
 14. The semiconductordevice according to claim 1, wherein the semiconductor chip includes aplurality of memory chips which are stacked but displaced horizontallysuch that bonding pads thereof are brought close to each other.
 15. Thesemiconductor device according to claim 14, wherein the memory chips areNAND flash memories.
 16. A semiconductor device comprising: asemiconductor chip with bonding pads, the bonding pads being arrangedalong one side of an element forming surface of the semiconductor chip;a lead frame including internal leads, the internal leads being arrangedon the element forming surface of the semiconductor chip and close tothe bonding pads thereof such that tips of the internal leads correspondto the bonding pads of the semiconductor chip; bonding wires by whichthe tips of the internal leads and the bonding pads of the semiconductorchip are bonded; a hanging pin section provided on the element formingsurface of the semiconductor chip; and a sealing member with which thesemiconductor chip is sealed including the hanging pin section and abonding section between the internal leads and the bonding wires, thesealing member being rectangular.
 17. The semiconductor device accordingto claim 16, wherein the lead frame further includes external leadscommunicating with the internal leads, and the external leads protrudefrom opposing short sides of the sealing member.
 18. The semiconductordevice according to claim 16, wherein the semiconductor chip is sealedsuch that one side thereof along which the bonding pads are arrangedcorresponds to one of long sides of the sealing member.
 19. Thesemiconductor device according to claim 16, wherein the semiconductorchip is sealed facedown with the sealing member such that the elementforming surface thereof faces down.
 20. The semiconductor deviceaccording to claim 16, wherein the semiconductor chip is sealed face upwith the sealing member such that the element forming surface thereoffaces up.